JPH0526341B2 - - Google Patents
Info
- Publication number
- JPH0526341B2 JPH0526341B2 JP58030275A JP3027583A JPH0526341B2 JP H0526341 B2 JPH0526341 B2 JP H0526341B2 JP 58030275 A JP58030275 A JP 58030275A JP 3027583 A JP3027583 A JP 3027583A JP H0526341 B2 JPH0526341 B2 JP H0526341B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- semiconductor layer
- layer
- interlayer insulating
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58030275A JPS59155951A (ja) | 1983-02-25 | 1983-02-25 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58030275A JPS59155951A (ja) | 1983-02-25 | 1983-02-25 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59155951A JPS59155951A (ja) | 1984-09-05 |
JPH0526341B2 true JPH0526341B2 (en]) | 1993-04-15 |
Family
ID=12299154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58030275A Granted JPS59155951A (ja) | 1983-02-25 | 1983-02-25 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59155951A (en]) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61179552A (ja) * | 1985-02-05 | 1986-08-12 | Agency Of Ind Science & Technol | 半導体装置の製造方法 |
JPH0622264B2 (ja) * | 1985-12-17 | 1994-03-23 | 工業技術院長 | 半導体装置の製造方法 |
JPS62190743A (ja) * | 1986-02-18 | 1987-08-20 | Agency Of Ind Science & Technol | 垂直配線の形成方法 |
JPS62190744A (ja) * | 1986-02-18 | 1987-08-20 | Agency Of Ind Science & Technol | 垂直配線構造 |
US4807021A (en) * | 1986-03-10 | 1989-02-21 | Kabushiki Kaisha Toshiba | Semiconductor device having stacking structure |
US5191405A (en) * | 1988-12-23 | 1993-03-02 | Matsushita Electric Industrial Co., Ltd. | Three-dimensional stacked lsi |
DE4400985C1 (de) * | 1994-01-14 | 1995-05-11 | Siemens Ag | Verfahren zur Herstellung einer dreidimensionalen Schaltungsanordnung |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51118975A (en) * | 1975-03-19 | 1976-10-19 | Hitachi Ltd | Photo controll semiconductor unitegrated circuit device |
-
1983
- 1983-02-25 JP JP58030275A patent/JPS59155951A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59155951A (ja) | 1984-09-05 |
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